The trend of the same kind of wafer in the five directions is the same. The elastic recovery rate is lower in the two directions of 45 ° and 135 °. The closer the crystal plane is to the (110) plane, the higher the elastic recovery rate.
The same wafer trend in five directions is the same, at 45 degrees, 135 degrees in both directions, the elastic response rate is lower, the closer the crystal surface to the (110) surface of the elastic response rate is higher.
The trend of the same kind of wafer is the same in five directions, the elastic recovery rate is lower in 45 ° and 135 ° directions, and the closer the crystal surface is to the (110) surface, the higher the elastic recovery rate.<br>