The rapid development of the modern

The rapid development of the modern mobile communication technology has led to an urgent demand for miniaturized and lightweight fabrication of microwave circuitry and systems [1]. Low-temperature co-fired ceramics (LTCC) technology can facilitate the miniaturization of these devices by simultaneously decreasing the dielectric layer thickness and increasing the number of layers in multi-layered structures. Micrometer-scale dielectric layers generally require 20–30 layers of particles to be longitudinally stacked together to ensure their homogeneity and smoothness, which requires the use of nanometer-scale grains in ceramics fabrication [2]