As peeling measures Wehabeberu portion at the element isolation forming step, we have added the step of removing only the oxide film on the nitride film.
As a measure against film peeling of the wafer bevel part, we have added the step of removing only the oxide film on the nitride film in the element separation and formation process.
To remove the oxide film on the nitride film in the element separation forming process, the process of removing the oxide film on the nitride film is added.<br>