▪ W1 and W2, as well as V1 and V2< must be externally connected to eac的简体中文翻译

▪ W1 and W2, as well as V1 and V2<

▪ W1 and W2, as well as V1 and V2< must be externally connected to each other.▪ If not using the Current Limiter (OCL) function, leave the OCL and SD pins open, but the SD pin should be connected toGND if significant external noise is observed.▪ Place a pull-up resistor, RFO , between the 3.3 V or 5 V supply and the IC, selected according to anti-noise characteristics,even though a 1 MΩ pull-up resistor is built-in at the ¯ F¯O¯ pin. Note that connecting to the 3.3 V or 5 V supply without a pull-upresistor disables the TSD function (however, low-side UVLO protection and OCP function remain active).▪ To avoid malfunctions resulting from noise interference, place a 0.001 to 0.01 μF ceramic capacitor (CFO) between the ¯ F ¯O¯and COM2 pins.▪ To avoid malfunctions resulting from noise interference, the traces must be as short as possible between the IC and thebootstrap capacitors, Cbootx (approximately 1 μF).▪ To avoid malfunctions resulting from noise interference, place a 0.01 to 0.1 μF ceramic capacitor between the VCC1 andCOM1 pins, as well as between the VCC2 and COM2 pins. Also, the traces between them must be as short as possible.▪ To avoid malfunctions resulting from noise interference, the traces between the current sense resistor RS, which is placedbetween the LS and COM2 pins, and the IC must be as short and wide as possible.▪ To avoid malfunction, the wiring between the LS and COM2 pins should be as short as possible. When wiring cannot beshortened sufficiently, insert a fast diode between LS and COM2.
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结果 (简体中文) 1: [复制]
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▪W1和W2以及V1和V2 <必须在外部相互连接。<br>▪如果不使用限流器(OCL),请保持OCL和SD引脚断开,但<br>如果观察到明显的外部噪声,则应将SD引脚连接至GND。<br>▪在3.3 V或5 V电源和IC之间放置一个上拉电阻RFO,该电阻根据抗噪声特性进行选择,<br>即使在F O处内置了一个1MΩ上拉电阻。销。请注意,在没有上拉<br>电阻的情况下连接到3.3 V或5 V电源会禁用TSD功能(但是,低侧UVLO保护和OCP功能仍处于活动状态)。<br>▪为了避免由于噪声干扰而导致的故障,请在¯F¯¯O <br>和COM2引脚之间放置一个0.001至0.01 µF的陶瓷电容器(CFO)。<br>▪为避免噪声干扰引起的故障,IC和<br>自举电容器Cbootx 之间的走线必须尽可能短(约1μF)。<br>▪为避免噪声干扰导致的故障,请在VCC1和<br>COM1引脚之间以及VCC2和COM2引脚之间放置一个0.01至0.1 F的陶瓷电容器。而且,它们之间的走线必须尽可能短。<br>▪为避免噪声干扰引起的故障,位于<br>LS和COM2引脚之间的电流检测电阻RS 和IC 之间的走线必须尽可能短且宽。<br>▪为避免故障,LS和COM2引脚之间的接线应尽可能短。无法接线时<br>充分缩短,在LS和COM2之间插入一个快速二极管。
正在翻译中..
结果 (简体中文) 2:[复制]
复制成功!
▪ W1 and W2, as well as V1 and V2< must be externally connected to each other.<br>▪ If not using the Current Limiter (OCL) function, leave the OCL and SD pins open, but the SD pin should be connected to<br>GND if significant external noise is observed.<br>▪ Place a pull-up resistor, RFO , between the 3.3 V or 5 V supply and the IC, selected according to anti-noise characteristics,<br>even though a 1 MΩ pull-up resistor is built-in at the ¯ F¯O¯ pin. Note that connecting to the 3.3 V or 5 V supply without a pull-up<br>resistor disables the TSD function (however, low-side UVLO protection and OCP function remain active).<br>▪ To avoid malfunctions resulting from noise interference, place a 0.001 to 0.01 μF ceramic capacitor (CFO) between the ¯ F ¯O¯<br>and COM2 pins.<br>▪ To avoid malfunctions resulting from noise interference, the traces must be as short as possible between the IC and the<br>bootstrap capacitors, Cbootx (approximately 1 μF).<br>▪ To avoid malfunctions resulting from noise interference, place a 0.01 to 0.1 μF ceramic capacitor between the VCC1 and<br>COM1 pins, as well as between the VCC2 and COM2 pins. Also, the traces between them must be as short as possible.<br>▪ To avoid malfunctions resulting from noise interference, the traces between the current sense resistor RS, which is placed<br>between the LS and COM2 pins, and the IC must be as short and wide as possible.<br>▪ To avoid malfunction, the wiring between the LS and COM2 pins should be as short as possible. When wiring cannot be<br>shortened sufficiently, insert a fast diode between LS and COM2.
正在翻译中..
结果 (简体中文) 3:[复制]
复制成功!
▪ W1和W2以及V1和V2<必须相互外部连接。<br>▪ 如果不使用限流器(OCL)功能,保持OCL和SD引脚打开,但SD引脚应连接至<br>如果观察到明显的外部噪声,则为GND。<br>▪ 在3.3V或5V电源和IC之间放置一个根据抗噪声特性选择的上拉电阻器RFO,<br>即使“F”和“O”引脚上内置了1 MΩ的上拉电阻器。请注意,连接至3.3 V或5 V电源时无需上拉<br>电阻器禁用TSD功能(但是,低压侧UVLO保护和OCP功能保持激活)。<br>▪ 为避免因噪声干扰而导致的故障,在“F”和“O”之间放置一个0.001至0.01μF陶瓷电容器(CFO)<br>和COM2引脚。<br>▪ 为了避免因噪声干扰而导致的故障,IC和<br>自举电容器,Cbootx(约1μF)。<br>▪ 为避免噪声干扰引起的故障,在VCC1和<br>COM1引脚,以及VCC2和COM2引脚之间。而且,它们之间的痕迹必须尽可能短。<br>▪ 为了避免因噪声干扰而导致的故障,在电流感应电阻器RS之间的轨迹<br>在LS和COM2引脚之间,IC必须尽可能短和宽。<br>▪ 为避免故障,LS和COM2引脚之间的接线应尽可能短。当接线不能<br>充分缩短,在LS和COM2之间插入一个快速二极管。<br>
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