In the top test, the PAD is back-pressured with a single side of 0.15mm to increase the bonding force; the top and bottom layers are partially cut out of copper, and the vias and wires are moved; please confirm whether it is OK?
The top layer test pad has a back pressure of 0.15mm on one side to increase the bonding force; Local copper cutting, through-hole removal and wire removal at the top and bottom layers; Please confirm whether it is OK?<BR>
Test the top PAD with a back pressure of 0.15mm on one side to increase the bonding force; Local copper tapping, via hole removal and wire removal on the top and bottom layers; Please confirm whether it is OK?