通过引入纳米氧化硅发现，如图3.3.2(b)，低湿和低压低湿养护下的试

By introducing nanometer silicon oxide found in FIG. 3.3.2 (b), the specimen under low humidity and low humidity reducing maintenance 50-200 nm pores. Especially in low-humidity environment for the conservation of the specimen, the specimen is hardly harmful 50-200 nm pores present.

Through the introduction of nanosilica oxide, it was found that, as shown in Figure 3.3.2 (b), 50-200 nanometer holes were reduced in the test piece under low wet and low-humidity maintenance. Especially for the maintenance of the test parts in low humidity environment, the test parts almost do not exist 50-200 nanometers of harmful holes.

Through the introduction of nano silicon oxide, it is found that, as shown in Fig. 3.3.2 (b), the pores of 50-200 nm in the specimen under low humidity and low pressure and low humidity curing are reduced. Especially for the specimens cured in low humidity environment, there are almost no harmful pores of 50-200 nm in the specimens.<br>