激光刻蚀是光刻技术的一种应用，利用高能量的激光束使材料在瞬间汽化蒸发，

Laser etching is an application of photolithography technology, which uses high-energy laser beams to vaporize and evaporate materials instantaneously to form holes, slits, and grooves. It is widely used in industrial heat treatment, welding, cutting, and marking. In the field of photovoltaics, the laser can selectively remove materials through the ablation process, thereby achieving the texturing of the silicon surface. As shown in the figure, during the laser etching process, the silicon wafer is placed in a hollow chamber with a vacuum, nitrogen or SF4 inside. The laser as an energy source emits a laser beam of a specific frequency and wavelength through the NDF, prism, polarizer, and irradiates the silicon vertically Engrave the surface and save the data results by the DCC camera.

Laser etching is an application of lithography technology, the use of high-energy laser beam to vaporize materials in an instant, forming holes, slits, grooves, widely used in industrial heat treatment, welding, cutting and marking and other processing fields. In the field of photovoltaics, lasers can selectively remove materials through the ablation process, enabling the texture of silicon surfaces. As shown in the figure, during laser etching, the silicon wafer is placed in a hollow chamber, inside is a vacuum, nitrogen or SF4, the laser as an energy source to emit a specific frequency and wavelength of the laser beam through the NDF, prism, polarizing mirror, vertical exposure to the silicon surface, it is carved, the data results are saved by the DCC camera.

Laser etching is an application of photolithography. It uses high-energy laser beam to vaporize materials in an instant, forming holes, seams and grooves. It is widely used in industrial heat treatment, welding, cutting, marking and other processing fields. In photovoltaic field, laser can selectively remove materials through ablation process, so as to achieve the texturization of silicon surface. As shown in the figure, in the laser etching process, the silicon wafer is placed in the hollow cavity, which is a vacuum, nitrogen or SF4. The laser, as an energy source, emits a laser beam of a specific frequency and wavelength through NDF, prism, polarizer, and vertically irradiates the silicon surface, carving it, and the data results are saved by DCC camera.<BR>