通过不同铜盐刻蚀体系制绒n型单晶硅得到了纳米倒金字塔结构，类倒金字塔结

The n-type monocrystalline silicon was textured by different copper salt etching systems to obtain nano-inverted pyramid structure, inverted pyramid-like structure and pit-like structure. Through the formation process of different structures, from the etching morphology, etching rate, and reflectivity The characteristics of different copper salt systems in the etching process of crystalline silicon are analyzed from an equal angle. Finally, the deposition behavior of different copper salt deposition systems on silicon wafers and how different anions affect the deposition of copper ions during the etching process are compared and analyzed. Different etching behavior, etching morphology and reflectivity.

通过不同铜盐刻蚀体系制绒n型单晶硅得到了纳米倒金字塔结构，类倒金字塔结构及凹坑状结构，通过不同结构的形成过程，从刻蚀形貌，刻蚀速率，反射率等角度分析了不同铜盐体系刻蚀晶硅过程中的特点，最后对比分析了不同铜盐沉积体系在硅片上的沉积行为及在刻蚀过程中不同阴离子是如何影响铜离子的沉积进而导致不同的刻蚀行为，刻蚀形貌及反射率的。

The nano inverted pyramid structure, inverted pyramid like structure and pit like structure were obtained by different copper salt etching systems. The characteristics of different copper salt systems in the process of etching crystalline silicon were analyzed from the aspects of etching morphology, etching rate and reflectivity. Finally, the deposition behavior of different copper salt deposition systems on silicon wafer was compared and analyzed In the etching process, how different anions affect the deposition of copper ions, and then lead to different etching behavior, etching morphology and reflectivity.<BR>