Requirements for components in industrial applications1. Design Records Product Specification Data Sheet, Package Outline Solderability - lead free according to JEDC-J-STD-020, MSL- Data, PSL- Data Lead frame material/ external lead- plating composition including thickness ESD- Data (HBM, CDM) Marking/ Identification label + relevant traceability data (LOT No., Date code) Flammability rating Address and DUNS-Nr. of production sites: (Wafer- Fab, Wafer - Test; Assembly; Final - Test) Errata Sheets