We present a compact integration of passive and active components, as well as a system packaging solution based on gapwaveguide technology with a flexible mechanical assembly.An E-band radio transceiver module consisting of a high-gainarray antenna, a diplexer, and Tx/Rx chipsets (all in one package) is designed with the capability of sending and receivingdata simultaneously at the 71–76- and the 81–86-GHz bandswith a frequency-division duplex (FDD) transmission scheme.The design procedure and performance verification of eachbuilding block, i.e., diplexer, 16 × 16 slot array antenna,circuitry, and packaging, are presented. In this paper, we haveshown the impressive packaging and integration features thatgap waveguide technology offers to build up a complex systemwith simple mechanical assembly.