The 3-inch copper samples used in this experiment are all cut from 12 inch Cu covered wafers. Before the experiment, the Cu sample was washed with 0.025m citric acid solution for 1 minute and dried by N2 purging. This is referred to and defined as the fresh Cu surface. The following chemicals are used for experiments: BTA (99%), FA / O II chelating agent (pH = 13.85), arginine (C6H14N4O2, 98%), TritonX-100 (C (CH3) 3ch2c (CH3) 2-c6h4 (och2ch2) 10Oh, 99%). Immerse the Cu sample in 0.05m BTA solution for 10min, take it out and dry it with N2, and then use the cleaning solution consisting of 200ppmfa / O II chelating agent and different concentrations of arginine (100, 150, 200, 250 and 300ppm), the cleaning solution consisting of 200ppmfa / O II chelating agent, 200ppm arginine and different concentrations of Triton X-100 (1600, 1800, 2000, 2200 and 2400ppm) to brush the polluted Cu with PVA Wash for 5min, set the flow rate to 1L / min, and adjust the pH value of cleaning solution with diluted KOH to fix it at 10.8. Use jc2000d contact angle measuring instrument (purchased from Shanghai Zhongchen Limited) to measure the contact angle of Cu surface before and after cleaning, and take the average value of three measuring points for each sample. The surface roughness of each copper sample was measured by atomic force microscope (AFM, Agilent 5600LS, USA). In addition, the wettability of Triton X-100 to Cu BTA surface was studied by contact angle experiment. Drop deionized water and Triton X-100 solution on the surface of fresh copper sample polluted by BTA respectively, and observe the change of contact angle. The surface tension (FS) of Triton X-100 solution was measured by suspension drop method.<br>
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