1.模拟仿真出元器件的温升，计算出散热焊盘的面积；2.散热焊盘要打过孔

1. Simulate the temperature rise of the components and calculate the area of ​​the heat dissipation pad; <br>2. The heat dissipation pad should be drilled to the bottom, and a window should be opened at the bottom to dissipate heat; <br>3. When the power consumption of the chip on the PCB is large, A radiator needs to be installed. If the board space permits, the outline of the heat sink needs to be marked on the PCB with a silk screen according to the actual size;

1. Simulate the temperature rise of the components and calculate the area of the thermal pad;<br>2. The heat dissipation pad should punch through the hole to the bottom and open the window at the bottom to dissipate heat;<br>3. When the chip on the PCB consumes more power, the radiator needs to be installed. If space on the board allows, the outline of the radiator needs to be marked with a silk screen on the PCB according to the real size;

1. Simulate the temperature rise of components and calculate the area of heat dissipation pad;<br>2. The heat pad should be perforated to the bottom, and a window should be opened at the bottom for heat dissipation;<br>3. When the power consumption of the chip on the PCB is high, the radiator needs to be installed. If the space on the board allows, the outline of the radiator needs to be marked by silk screen on the PCB according to the real size;