电流带来的位错热激活和电子风力，促使位错脱钉，提高位错湮灭的概率，进而

The thermal activation of dislocations and the electronic wind caused by the current promote the dislocation of dislocations, increase the probability of dislocation annihilation, thereby reduce the dislocation density, shorten the dislocation waiting time (strain rate is unchanged), and inhibit the dislocation of solute atoms. Pinned.

The misplaced thermal activation and electron wind brought about by the current promote misplaced nails, increase the probability of misalignment annihilation, and thus reduce the misalignment density, shorten the misalignment wait time (strain rate unchanged), and inhibit the misplaced nailing of solute atoms.

The dislocation thermal activation and electron wind force caused by electric current promote dislocation depinning, increase the probability of dislocation annihilation, reduce dislocation density, shorten dislocation waiting time (strain rate unchanged), and inhibit the pinning of solute atoms to dislocations.<br>