在本文中，将精氨酸和Triton X-100作为主要的络合剂和表面活性

Herein, arginine, and Triton X-100 was added to the washing liquid based on FA / O II in order to remove the effect of the change in concentration of BTA studies (three chemical substances as the primary surfactant and complexing agent molecular structure shown in Figure 1). Compared with other methods described above, we use the low price of chemicals, non-volatility, low toxicity and environmental protection, more suitable for large-scale use of the industrial sector. In detail, FA / O II having 13 or more chelate rings, it can react to form a stable chelate with copper ions, although the organic amines polyhydroxy macromolecule, but will not evaporate due to the high vapor pressure into the environment thereby causing deterioration in the photolithography process [17]. Arginine is a basic amino acid, containing amino and carboxyl functional groups may be combined to promote the complex copper ions to prevent the redeposition of [23-24]. Triton X-100 is a nonionic surfactant having a low surface tension and good wettability, during the cleaning process do not introduce ionic contaminants [25-26]. In our experiments, the contact angle and electrochemical methods are used to characterize the removed portion is calculated while BTA quantum mechanics parameters arginine, then we use the atomic force microscopy (AFM) analysis of the morphology of the copper surface after cleaning.

In this paper, arginine and Triton X-100 are added as the primary complexagent and surfactant to the FA/O II-based cleaning fluid to study the effect of concentration changes on the removal of BTA (the molecular structure of the three chemicals is shown in Figure 1). Compared with the other methods mentioned above, the chemicals we use are inexpensive, non-volatile, low-toxic and environmentally friendly, and more suitable for large-scale use in the industrial sector. In detail, FA/O II has more than 13 chelate rings that can react with copper ions to form a stable chelating, although it is a polyhydroxy polyamine organic macromolecule, but does not evaporate into the environment due to high vapor pressure, resulting in the deterioration of the photolithography process. Arginine is an alkaline amino acid that contains amino and argon-based meta-energy groups that promote the integration of copper ions and prevent re-deposition. Triton X-100 is a non-ionic surfactant with low surface tension and good wetting, and does not introduce ion contamination during cleaning. In our experiment, contact angles and electrochemical methods were used to characterize the removal of BTA and to calculate some of the quantum mechanical parameters of arginine, and then we used atomic force microscopy (AFM) to analyze the shape of the cleaned copper surface.

In this paper, arginine and Triton X-100 are added to the cleaning solution based on FA / O II as the main complexing agent and surfactant to study the removal effect of BTA by concentration change (the molecular structure of the three chemicals is shown in Figure 1). Compared with other methods mentioned above, the chemicals we used are cheap, non-volatile, low toxic and environmentally friendly, and more suitable for large-scale use in the industrial field. In detail, FA / O II has more than 13 chelating rings, which can react with copper ions to form stable chelates. Although it is a polyhydroxypolyamine organic macromolecule, it will not evaporate to the environment due to high vapor pressure, resulting in deterioration of photolithography process [17]. Arginine is an alkaline amino acid, containing amino and carboxyl functional groups, which can promote the complexation of copper ions and prevent redeposition [23-24] Triton X-100 is a non-ionic surfactant with low surface tension and good wettability, which will not introduce ion pollution in the cleaning process [25-26]. In our experiment, contact angle and electrochemical method were used to characterize BTA removal and calculate some quantum mechanical parameters of arginine. Then, we analyzed the surface morphology of cleaned copper by atomic force microscope (AFM).<br>