The backscattered scanning electron micrographs of Li2MoO4-Ag multilayer using the CSCC technology are shown in Figure 5. A dense and homogeneous microstructure can be observed. As the CSP of Li2MoO4-Ag multilayer is assisted by pressure, there is no delamination or warping, which may occur in the conventional thermal sintering process, the areal size of these multilayers are about 2.7 cm 9 2.7 cm. From the metal/ceramic interface shown in Figure 5C, it is seen that Ag electrode and Li2MoO4 ceramic coexist with each other, and there is no chemical reaction between them. The Ag/Li2MoO4 boundary is also clear, and no obvious interdiffusion is detected. This multilayer structure formed from cold sintering technique indicates that CSCC technology is a promising method to fabricate ceramic-metal multilayers.