In this paper, by changing the relevant process parameters in the process of magnetorheological polishing to improve the formation of scratches on the wafer surface and improve the surface quality.
In this paper, by changing the relevant process parameters in the process of magnetic rheumating polishing, the formation of the surface scratches of the wafer is improved and the surface quality is improved.
In this paper, the formation of scratches on the wafer surface is improved and the surface quality is improved by changing the relevant technological parameters in the process of MRF polishing.<br>