Chemical mechanical polishing (CMP) is introduced as a new and synergistic method for structuring metallic implant surfaces.•CMP implementation tailors surface morphology to be smooth or nano/micro rough enabling control of biocompatibility of implant.•The chemical action induced by CMP functions to form a protective nano-scale oxide layer which helps limit bacteria growth.•Cell attachment analyses demonstrated an optimal level of surface roughness for maximum biocompatibility controllable by the CMP.