材料加过程中，会有参考面的选择。主参考面是规范化圆形晶片长度最长的参考

In the process of adding materials, there will be the choice of reference surface. The main reference surface is the reference surface with the longest length of a normalized round wafer, and its orientation is usually a specific crystal direction. The main reference plane is also called the best scribe orientation. The secondary reference plane is a reference plane with a shorter round wafer length than the primary reference plane, and its position relative to the primary reference plane is used to mark the conductivity type and crystal orientation of the wafer. As shown in the figure, there are five directions in which the abrasive particles scrub on the GaAs surface.

During the material addition process, there will be a choice of reference surfaces. The main reference face is the longest reference face for normalized circular wafers, and its orientation is usually in a specific crystal direction. The main reference face is also called the best scribe orientation. The sub-reference face is a reference face with a normalised circular wafer length shorter than the main reference face, which is used relative to the position of the main reference surface to mark the conductive type and crystal direction of the wafer. Pictured, are the five directions in which the grain is scratched on the surface of GaAs.

In the process of material addition, there will be selection of reference surface. The main reference plane is the longest reference plane of normalized circular wafer, and its orientation is usually a specific crystal direction. The main reference plane is also called the best scribe position. The sub reference plane is the reference plane whose length is shorter than that of the main reference plane. The position of the sub reference plane relative to the main reference plane is used to mark the conductivity type and crystal direction of the wafer. As shown in the figure, there are five directions for abrasives to scratch on GaAs surface.<br>