Figure 2. Microstructure analysis of TIC. a) Tan δ change of TIC as a function of temperature, which shows the glass transition temperature. b) Ga2p3, In3d photoelectron spectra measured for different depth of TIC before and after freezing, which is tested by XPS. c) Tensile stress versus strain for TICs with different droplets radius (12, 20, 50, and 140 µm) and elastic modulus versus different radius. d) Microscopy image of TIC with different liquid metal loadings (ϕ = 10%, 30%, and 50%). TIC (ϕ = 40%) fabricated with different stirring time (60, 120, 180, 240, and 300 s) and the longer the stirring time, the smaller the droplets size, the scale bar is 200 µm. e) SEM image of the bottom side of TIC with stirring time of 360 s.