Table 9-1 Plated-Through Holes with Component Leads, Minimum Acceptable Conditions1Criteria Class 1 Class 2 Class 3A. Circumferential wetting on solderdestination side of lead and barrelNot specified 180o 270oB. Vertical fill of solder 3 Not specified 75% 75%C. Circumferential fillet and wetting on soldersource side of lead and barrel2270o 270o 330 ºD. Percentage of original land area coveredwith wetted solder on solder destinationside0 0 0E. Percentage of original land area coveredwith wetted solder on solder source side.75% 75% 75%Notes:1. Wetted solder refers to solder applied by the solder process.2. This applies to any side to which solder was applied.3. The 25% unfilled height includes both source and destination side depressions.