Figure 6-12 Side Route Connections and Wrap on Bifurcated Terminal1. Base2. Terminal post3. Lead6.3.2.3 Top and Bottom Route Connections Bottom routed wires shall (A1 P2 D3) be wrapped on the terminal base or post with aminimum of 90° bend (see Figure 6-13) . Wire insulation shall not (A1 P2 D3) enter the base of post of terminal. When top routedwires to bifurcated terminals are required by the design, the wire shall (A1 P2 D3) feed straight into the terminal between the tines.Any remaining space between the tines shall (A1 P2 D3) be filled by having the wire bent double or by using a separate filler wire(see Figure 6-13) .6.3.3 Hook Terminalsa. Wire(s) shall (A1 P2 D3) be wrapped 180° minimum.b. Wire(s) shall (A1 P2 D3) be no closer than one wire diameter to the end of the hook.c. Wire(s) should be within the arc of the hook. See Figure 6-14.d. For components using hook terminations, wires shall (A1 P2 D3) be spaced a minimum of two lead diameters or 1.0 mm [0.039 in],whichever is greater, from the base of the terminal.6.3.4 Pierced or Perforated Terminals For wiring to a single terminal, the wire(s) shall (A1 P2 D3) pass through the eye and bewrapped around the terminal a minimum of 90° (see Figure 6-15).For user approved designs which incorporate staking/bonding of wires, the wire(s) attached to pierced terminals shall (A1 P2 D3)contact at least two surfaces of the terminal.6.3.5 Cup and Hollow Cylindrical Terminal Soldering The lay of the strands of any wire shall (A1 P2 D3) meet the requirementsof 6.1.3. Strands shall not (NoRqtEst.1 D2 D3) be removed for the purpose of installation. The wire or wires shall (NoRqtEst.1 P2D3) be inserted for the full depth of the cup.Figure 6-13 Top and Bottom Route Terminal ConnectionFigure 6-14 Hook Terminal ConnectionsFigure 6-15 Pierced or Perforated Terminal Wire Wrap6.4 Surface Mounting of Components6.4.1 Parts Not Configured for Surface Mounting Components of the through-hole configuration (e.g., transistors, metal powerpackages, and other nonaxial leaded components), shall not (D1 D2 D3) be surface mounted unless the leads are formed to meet thesurface mount device lead forming requirements.6.4.2 Devices with External Deposited Elements Devices with External Deposited Elements , Components with electrical elements deposited on an externalsurface (such as chip resistors) shall (NoReqEstablished1 P2 P3) be mounted with that surface away from the printed board orsubstrate.