Copper surface treatment by plating, chemical nickel or improper NiPdAu chemical, electrical and other process control measurement; resulting plated surface caused by indentations or recesses.
The coating is not properly controlled due to the processing of copper surface, chemical nickel gold or chemical nickel palladium, electro-test, etc., resulting in indentation or depression on the surface of the coating.
Due to improper process control such as copper surface treatment, chemical nickel gold or chemical nickel palladium, electrical measurement, etc., the coating surface causes indentation or depression.<br>