Leaded Chip Carrier – A chip carrie

Leaded Chip Carrier – A chip carrier whose external connectionsconsist of leads that are around and down the sideof the package. (See also ‘‘Leadless Chip Carrier.’’)*Master Drawing – A control document that shows thedimensional limits or grid locations that are applicable toany and all parts of a product to be fabricated, includingthe arrangement of conductors and nonconductive patternsor elements; the size, type, and location of holes; and allother necessary information.Mixed Component-Mounting Technology – A componentmounting technology that uses both through-hole andsurface-mounting technologies on the same packaging andinterconnecting structure.*Module – A separable unit in a packaging scheme.Nominal Dimension – A dimension that is between themaximum and minimum size of a feature. (The toleranceon a nominal dimension gives the limits of variation of afeature size.)*Packaging and Interconnecting Structure (P&IS) – Thegeneral term for a completely processed combination ofbase materials, supporting planes or constraining cores, andinterconnection wiring that are used for the purpose ofmounting and interconnecting components.*Plated-Through Hole (PTH) – A hole with plating on itswalls that makes an electrical connection between conductivepatterns on internal layers, external layer, or both, of aprinted board.*Primary Side – The side of a packaging and interconnectingstructure that is so defined on the master drawing. (It isusually the side that contains the most complex or the mostnumber of components.)*Printed Board (PB) – The general term for completelyprocessed printed circuit and printed wiring configurations.(This includes single-sided, double-sided and multilayerboards with rigid, flexible, and rigid-flex base materials.)*Printed Wiring – A conductive pattern that providespoint-to-point connections but not printed components in apredetermined arrangement on a common base. (See also‘‘Printed Circuit.’’)*Registration – The degree of conformity of the positionof a pattern (or portion thereof), a hole, or other feature toits intended position on a product.*Secondary Side – That side of a packaging and interconnectingstructure that is opposite the primary side. (It is thesame as the ‘‘solder side’’ on through-hole mounting technology.)*Single-Inline Package (SIP) – A component packagewith one straight row of pins or wire leads.