Cure Speed vs. Bond GapThe rate of cure will depend on the bondline gap. Thin bondlines result in high cure speeds, increasing the bond gap willdecrease the rate of cure.Cure Speed vs. HumidityThe rate of cure will depend on the ambient relativehumidity. The best results are achieved when the relativehumidity in the working environment is 40% to 60% at 22°C.Lower humidity leads to slower cure. Higher humidityaccelerates it, but may impair the final strength of the bond.Cure Speed vs. ActivatorWhere cure speed is unacceptably long due to large gaps,applying activator to the surface will improve cure speed.However, this can reduce ultimate strength of the bond andtherefore testing is recommended to confirm effect.