IPC-A-49 Surface Mount Land Pattern Artwork (IPC-SM-782)IPC-T-50 Terms and Definitions for Interconnecting andPackaging Electronic CircuitsIPC-A-610 Acceptability of Printed Board AssembliesIPC-SM-785 Guidelines for Accelerated Reliability Testingof Surface Mount Solder AttachmentsIPC-S-816 SMT Process Guideline and ChecklistIPC-1902 Grid System for Printed CircuitsIPC-2221 Generic Standard on Printed Board DesignIPC-2226 Sectional Design Standard for High DensityInterconnect (HDI) Printed BoardsIPC-2581 Generic Requirements for Printed Board AssemblyProducts Manufacturing Description Data and TransferMethodologyIPC-6012 Qualification and Performance Standard forRigid Printed BoardsIPC-7095 Design and Assembly Process Implementationfor BGAsIPC-7525 Stencil Design GuidelinesIPC-7530 Guidelines for Temperature Profiling for MassSoldering ProcessesIPC-7711/21 Rework and Repair GuideIPC-9701 Performance Test Methods and QualificationRequirements for Surface Mount Solder Attachments2.2 Electronic Industries Association2EIA-481 Tape and Reel Specification2.3 Joint Industry Standards (IPC)3J-STD-001 Requirements for Soldered Electrical and ElectronicAssembliesJ-STD-002 Solderability Tests for Component Leads, Terminations,Lugs, Terminals and WiresJ-STD-003 Solderability Tests for Printed BoardsJ-STD-033 Handling, Packing, Shipping and Use ofMoisture/Reflow Sensitive Surface Mount Devices