而在电流密度为55A/mm2的条件下，各晶粒尺寸样品的屈服平台长度增大

However, under the condition of current density of 55A/mm2, the yield plateau length of each grain size sample increases, indicating that the solid solution strengthening caused by the solute atom pinning dislocation under this parameter is weaker under the action of this parameter. Due to the softening caused by the decrease in dislocation density, dislocation multiplication slows down, and the time for deformation to enter the work hardening stage is increased, which is reflected in the increase of Lüders strain and the obvious decrease in the yield strength of samples of various grain sizes;

Under the condition that the current density is 55A/mm2, the yield platform length of each grain size sample increases, indicating that under the current action of this parameter, that is, the solidification strengthening caused by the misplaced solute of the solute under this parameter is weaker than the softening caused by the decrease of the misalignment density, the misplaced proliferation is slower, which increases the time for the deformation to enter the processing hardening stage, which is reflected in the increase of Ludes strain and the yield strength of each grain size sample.

The yield platform length of each grain size sample increases under the condition of current density of 55a/mm2. It shows that under the current action of this parameter, the solid solution strengthening caused by dislocation pinning by solute atom is weaker than that caused by dislocation density reduction, dislocation proliferation slows, and the time of deformation entering the processing hardening stage is increased, The results show that the strain of ludes increases and the yield strength of the samples of each grain size decreases obviously;<br>