铝是金属基复合材料中最常用的基体材料，因为(i)铝的熔化温度低，可以在

Aluminum is the most commonly used matrix material in metal matrix composites because (i) aluminum has a low melting temperature and can be cast at a lower temperature, and (ii) aluminum has a low density. The high density of copper makes it unattractive for lightweight composite materials, but its high thermal conductivity and low resistivity make it attractive for electronic applications (Table 6.2). As shown in Table 6.2, the properties of metals and ceramics are very different. Metal has electrical and thermal conductivity. The thermal conductivity of aluminum and copper (Table 6.2) is higher than any of the listed materials, while the resistivity of aluminum and copper (many orders of magnitude lower than any of the listed ceramics). However, compared to ceramics, most metals have a high coefficient of thermal expansion (cte) and a low modulus of elasticity. The thermal expansion coefficients of aluminum and copper are higher than the listed ceramics, and the elastic modulus of aluminum and copper are lower than the listed ceramics. The density of aluminum is comparable to ceramics, but the density of copper is higher than ceramics.

Aluminum is the most commonly used substrate material in metal-based composites because (i) aluminum has a low melting temperature and can be cast at lower temperatures, (ii) the density of aluminum is low. The high density of copper makes it unattractive for lightweight composites, but its high thermal conductivity and low resistivity make it attractive for electronic applications (Table 6.2). As shown in Table 6.2, the properties of metals and ceramics are very different. Metals have conductive and thermal properties. The thermal conductivity of aluminum and copper (Table 6.2) is higher than that of any of the materials listed, while the resistivity of aluminum and copper (many orders of magnitude lower than any of the ceramics listed). However, compared to ceramics, most metals have a high coefficient of thermal expansion (cte) and a low elastic modulus. The thermal expansion coefficient of aluminum and copper is higher than that of the listed ceramics, and the elastic modulus of aluminum and copper are lower than those of the listed ceramics. The density of aluminum is comparable to that of ceramics, but the density of copper is higher than that of ceramics.

Aluminum is the most commonly used matrix material in metal matrix composites, because (I) the melting temperature of aluminum is low, and it can be cast at a lower temperature, (II) the density of aluminum is low. The high density of copper makes it unattractive to lightweight composites, but its high thermal conductivity and low resistivity make it attractive for electronic applications (table 6.2). As shown in table 6.2, the properties of metals and ceramics are quite different. Metals have conductivity and thermal conductivity. The thermal conductivity of aluminum and copper (table 6.2) is higher than that of any of the listed materials, while the resistivity of aluminum and copper is much lower than that of any of the listed ceramics. However, compared with ceramics, most metals have high coefficient of thermal expansion (CTE) and low modulus of elasticity. The coefficient of thermal expansion of aluminum and copper is higher than that of the listed ceramics, and the modulus of elasticity of aluminum and copper is lower than that of the listed ceramics. The density of aluminum is the same as that of ceramics, but the density of copper is higher than that of ceramics.<br>