A considerable attention has recent

A considerable attention has recently been focused on the development of technology for the growth of thick or thin films due to miniaturization requirements of electronic devices [1–4]. Besides extreme efforts to improve the performance of electronic devices that are based on hard and brittle substrates, a new challenge in electronics is the ability of the material to survive the mechanical deformation. Flexible electronics, which can be bent, rolled, and stretched into arbitrary shapes, would significantly expand the application of modern electronic devices in the areas of computation,communications, displays, sensing, energy harvesting, and storage devices [5–7]. The most common ways for the preparation of flexible films are gravity casting[8–11] and hot pressing method [12–14]. The simplified way to obtain composite thick films with different filler contents is a gravitational casting method. Pascariu et al.[10] employed this method in order to obtain flat composites with compositional gradient along the thickness direction and in-plane homogeneous composition. They found that compositional gradients can be controlled to some extent by changing the filler properties, the matrix density, and the casting parameters. To date, less frequently used method for obtaining the flexible films has been hot pressing where the mixture of polymer matrix and active component (filler) is pressed at around 200 ℃ after which the thick sheets are obtained. Literature data have shown that this approach is very effective in manufacturing 2-2 composite structures [15].