1. SPC control for plating is filled up wongly in the control plan under frequnecy2. Reaction plan - too generic and missing consistent Man/Matl/Machine approach.There is no clear workflow or Wl.3. For plating thickness check - need error proofying for full lot data tracebility foraccuracy4. Flux cleaning inspection - recommend to have clear identification of which key location to inspect as current photo is very misleading