就是在处理过的铜面上贴上或涂上一层感光性膜层，在紫外光的照射下，将菲林

就是在处理过的铜面上贴上或涂上一层感光性膜层，在紫外光的照射下，将菲林底片上的线路图形转移到铜面上，形成一种抗蚀的掩膜图形，那些未被抗蚀剂保护的不需要的铜箔，将在随后的化学蚀刻工序中被蚀刻掉，经过蚀刻工艺后再褪去抗蚀膜层，得到所需的裸铜电路图形。

The resist layer that is not etched on the copper foil is then coated on the etching resist layer, which is not required to be etched on the copper foil, Get the required bare copper circuit pattern.

That is, a photosensitive film layer is pasted or coated on the treated copper surface, and under the irradiation of ultraviolet light, the circuit pattern on the film negative is transferred to the copper surface to form an anti-corrosion mask pattern. Those unnecessary copper foils that are not protected by the resist will be etched away in the subsequent chemical etching process, and then the anti-corrosion film layer will be removed after the etching process to obtain the required bare copper circuit pattern.