五、存在问题 （1）随着FPGA速度和密度的提高，纳米级加工引起的生产

5. Existing problems <br>(1) As the speed and density of FPGAs increase, the production efficiency problems caused by nanoscale processing are becoming more and more difficult to ignore. The influence of the semiconductor manufacturing process is multifaceted: the photolithography effect due to the change of the metal layer thickness, the doping fluctuation, the size of the logic gate and the change of the layer thickness due to the chemical mechanical polishing. and many more. In order to solve the performance error caused by the process, new processes and methods must be introduced in the design to reduce the negative impact of various types of instability on the production efficiency of the device. <br>(2) The power consumption of semiconductor devices includes static power consumption and dynamic power consumption. Static power consumption is the power consumption caused by the leakage current of all transistors in the device, including the leakage current from the source and drain to the substrate, the leakage current directly flowing from the gate to the substrate, and the sum of other transistors. Continuous energy consumption. The leakage current of FPGA largely depends on the power supply voltage, junction temperature, transistor size and its own programmable redundant structure. The dynamic power consumption is produced by the charging and discharging of the capacitive load inside the device. The main influencing factors are load capacity, power supply voltage and clock frequency. With the progress of process nodes, the capacity and density of FPGAs increase, and the clock frequency increases, the dynamic power consumption of the entire device is still an important issue that needs to be considered. <br>(3) In the nanoscale process, logical design should be combined with physical characteristics to accurately provide delay, power consumption, coverage capacity, area, so the final design delay before and after the increasing fallacy, the interconnection becomes delayed major factor. At the same time, the minimum width and spacing of interconnections are reduced, which makes the fluctuation range of device performance larger and larger, which has become a bottleneck restricting chip performance. Therefore, how to achieve system-level high-speed signal transmission on such a large chip to meet timing requirements and achieve a low clock tree structure, jitter and polarization has become a major issue in the current FPGA design. <br>(4) The electromagnetic compatibility problem caused by high-speed signals has become more and more prominent. As the width and spacing of metal wires continue to decrease, the phenomenon of fingerboards between interconnections has become more and more serious. Signal integrity issues have brought more testing to EDA tools, but also imposed stricter requirements on designers, manufacturers, and processors.<br>(5) The proportion of testing in integrated circuit design is increasing. The complexity of FPGA testing is determined by its own complex channel structure. In addition, in traditional FPGA devices, many IP modules are multiplied, and the pre-designed IP modules affect the testing of the system-on-chip. Therefore, designers are urged to consider implementing common verification and testing techniques in advance, and find ways to use fewer tests to detect more chip failures.

5、 Existing problems<br>(1) With the improvement of FPGA speed and density, the problem of production efficiency caused by nano processing is more and more difficult to ignore. The influence of semiconductor manufacturing process is multifaceted: lithography effect caused by the change of metal layer thickness, doping fluctuation, logic gate size and the change of layer thickness caused by chemical mechanical polishing. wait. In order to solve the performance fallacy caused by the process, new processes and methods must be introduced into the design to reduce the negative impact of various types of instability on the production efficiency of the unit.<br>(2) The power consumption of semiconductor devices includes static power consumption and dynamic power consumption. Static power consumption is the power consumption caused by the leakage current of all transistors in the device, including the leakage current from the source and drain to the substrate, the leakage current directly from the gate to the substrate, and the sum of other transistors. Sustained energy consumption. The leakage current of FPGA largely depends on the power supply voltage, junction temperature, transistor size and its own programmable redundancy structure. The dynamic power consumption is generated by the charge and discharge of the capacitive load inside the device. The main influencing factors are load capacity, power supply voltage and clock frequency. With the progress of process nodes, the capacity and density of FPGA increase, the clock frequency increases, and the dynamic power consumption of the whole device is still an important problem to be considered.<br>(3) In the nanoscale process, logic design should be combined with physical characteristics to accurately provide delay, power consumption, coverage and area. Therefore, in the final design delay before and after the increasing fallacies, interconnection has become the main factor of delay. At the same time, the minimum width and spacing of interconnection are reduced, which makes the fluctuation range of device performance larger and larger, and becomes the bottleneck restricting chip performance. Therefore, how to realize system level high-speed signal transmission on such a large chip to meet the timing requirements and realize low clock tree structure, jitter and polarization have become the main problems in FPGA design.<br>(4) The electromagnetic compatibility problem caused by high-speed signal is becoming more and more prominent. With the continuous reduction of the width and spacing of metal wires, the fingerboard phenomenon between interconnects is becoming more and more serious. The problem of signal integrity brings more tests to EDA tools, but it also puts forward more stringent requirements for designers, manufacturers and processors.<br>(5) The proportion of testing in integrated circuit design is increasing. The complexity of FPGA testing is determined by its own complex channel structure. In addition, in traditional FPGA devices, many IP modules are multiplied, and the pre-designed IP modules affect the test of system on chip. Therefore, designers are urged to consider implementing common verification and testing technologies in advance, and find ways to detect more chip faults with less testing.

V. Existing problems (1) With the increase of FPGA speed and density, the production efficiency caused by nano-scale processing becomes more and more difficult to ignore. The influence of semiconductor manufacturing process is various: photolithography effect caused by the change of metal layer thickness, doping fluctuation, logic gate size and the change of layer thickness caused by chemical mechanical polishing. Wait a minute. In order to solve the performance fallacy caused by the process, new processes and methods must be introduced in the design to reduce the negative influence of various types of instability on the production efficiency of the device. (2) The power consumption of semiconductor devices includes static power consumption and dynamic power consumption. Static power consumption is the power consumption caused by the leakage current of all transistors in the device, including the leakage current from the source and drain to the substrate, the leakage current flowing directly from the gate to the substrate and the sum of other transistors. Continuous energy consumption. The leakage current of FPGA largely depends on the power supply voltage, junction temperature, transistor size and its own programmable redundancy structure. Dynamic power consumption is caused by the charge and discharge of capacitive load inside the device. The main influencing factors are load capacity, power supply voltage and clock frequency. With the progress of process nodes, the capacity and density of FPGA increase, and the clock frequency increases. The dynamic power consumption of the whole device is still an important issue to be considered. (3) In the nanoscale process, logic design should be combined with physical characteristics to accurately provide delay, power consumption, coverage and area. Therefore, in the final design delay before and after increasing fallacies, interconnection becomes the main factor of delay. At the same time, the minimum width and spacing of interconnects are reduced, which makes the fluctuation range of device performance larger and larger, and becomes the bottleneck restricting chip performance. Therefore, how to realize the system-level high-speed signal transmission on such a large chip to meet the timing requirements and realize the low clock tree structure, jitter and polarization have become the main problems in the current FPGA design. (4) The problem of electromagnetic compatibility caused by high-speed signals is becoming more and more prominent. With the continuous reduction of the width and spacing of metal wires, the fingerboard phenomenon between interconnects is becoming more and more serious. Signal integrity brings more tests to EDA tools, but it also puts forward stricter requirements for designers, manufacturers and processors. (5) The proportion of testing in IC design is increasing. The complexity of FPGA test is determined by its own complex channel structure. In addition, in traditional FPGA devices, many IP modules multiply, and the pre-designed IP modules affect the test of SOC. Therefore, designers are urged to consider implementing universal verification and testing technology in advance, and find ways to detect more chip failures with fewer tests.