Each etched silicon wafer is cut into small pieces, and then processed by ultrasound, sulfuric acid, nitric acid solution for different times in a smooth manner
Each moment after the decay of the silicon wafer is cut into a few small pieces, and then by ultrasound, sulfuric acid, nitric acid solution smooth treatment at different times
Each etched silicon wafer is cut into several pieces, which are then smoothed by ultrasonic, sulfuric acid and nitric acid solutions for different times<BR>