1. After the glue is cast, the motherboard side is placed on the side to ensure that the chip is fully overflowed around the glue. After adhesive, curing is necessary within 15-20 minutes. <br>2. Before curing, it is necessary to confirm whether the chip overflow condition meets the requirements (there is overflow around the chip).<br>3. The out-of-glue air pressure parameter of the dosing machine is set to 0.1-0.3Mpa
正在翻译中..