tiny Cu-NPs in the SO42- system are deposited on the surface of the silicon wafer, which is soon oxidized by H2O2 but the contact area is large, which leads to a fast reaction rate
tiny Cu-NPs in the SO42- system are deposited on the surface of the silicon wafer, which is soon oxidized by H2O2 but the contact area is large, which leads to a fast reaction rate
tiny Cu-NPs in the SO42- system are deposited on the surface of the silicon wafer, which is soon oxidized by H2O2 but the contact area is large, which leads to a fast reaction rate