Of the various energy-efficient sin

在各种高能效烧结技术中，冷烧结工艺（CSP）具有超低温烧结的最大潜力。尽管大多数CSP论文已在过去5年内发表，但这项技术的起源可以追溯到金属1,2和1800到1950-1960年代的1800年代，当研究人员开始意识到水分的存在增加了氧化物的绿色密度时1,3,4在1970-1980年代，“冷烧结”一词最初是指利用“粉末颗粒在环境温度下在高压梯度下的塑性变形而产生的过程”，从而降低了烧结温度。金属，玻璃和离子晶体的“绿色密度接近理论值”。5同时，有人提出采用水热热压法（HHP）对水泥材料进行低温致密化处理。6,7Kähäri等人。表明Li2MoO4（LMO）可以在近室温下通过加水和更高的单轴压力进行烧结，并指出大颗粒有利于致密化[8,9]。将颗粒与少量溶剂（通常为水性或极性有机物）混合的过程。这样可以在低温和施加压力下控制溶出度；随后，溶剂会从开放系统中蒸发掉。10在许多冷烧结研究中，可以在〜300°C的温度下将陶瓷颗粒烧结至〜95％相对密度。8,9,11简而言之，在低温下的致密化是通过引入瞬态相实现单轴压力实现的，这些瞬态相通常会部分溶解陶瓷，重新排列颗粒紧密体，并在液相汽化时在孔中重新溶解溶解的离子。因此，CSP的烧结机理似乎类似于液相烧结（LPS）12,13或压力溶液蠕变（PSC）。14-16CSP的研究很快被数百种CSP的出版物和专利所采用。氧化物，11,17–21无机盐，22–25和复合材料26–30涵盖的应用包括高频天线，30,31能量存储电容器，32,33电池组件，22,24,25压敏电阻，11,26和压电传感器/actuators.18，34通过将低溶解度陶瓷与高溶解性盐或氧化物（例如Al2SiO5 / NaCl，35 PZT / Pb（NO3）2,18和PZT / Li2MoO4.34）混合来实现无机-无机复合材料的冷烧结。据推测，可溶相可润滑不溶性陶瓷，从而提高压实度。从这个角度来看，预计复合材料中的烧结机理与单相情况中的烧结机理有很大不同。该假设尚未得到证实，其根本机理也没有得到解释。预计复合材料中的烧结机理与单相情况中的烧结机理有很大不同。该假设尚未得到证实，其根本机理也没有得到解释。预计复合材料中的烧结机理与单相情况中的烧结机理有很大不同。该假设尚未得到证实，其根本机理也没有得到解释。

在各种节能烧结技术中，冷烧结工艺（CSP）具有超低温烧结的潜力最大。Though most of the CSP papers have been published within the past 5 years, the origin of this technique may be traced back to the 1800s for metals1,2 and 1950-1960s when researchers started to realize the presence of moisture increased the green density in oxides and sulfates which reduced the sintering temperatures.1,3,4 In the 1970-1980s, the word "cold sintering" was first used to refer to a process utilizing "plastic deformation of powder particles in a high pressure gradient at ambient temperature resulting in green densities close to theoretical" for metals, glass, and ionic crystals.5 At the same time, the hydrothermal hot-pressing (HHP) method was proposed for the densification of cement materials at low temperatures.6,7 Kähäri et al. showed Li2MoO4 (LMO) could be sintered at near room temperatures by adding water and higher uniaxial pressures8.9 宾夕法尼亚州立大学的小组概述了冷烧结过程的普遍战略，即颗粒与少量溶剂（通常是水性或极性有机物）混合。这可控制低温下溶解并施加压力;随后，溶剂从开放系统中蒸发。 陶瓷颗粒可以在 ±300 °C.8，9，11 下烧成 ±95% 相对密度，简言之，在如此低温下，通过引入单轴压力和瞬态相一起实现密度化，这些瞬变相（通常）部分溶解陶瓷，重新排列颗粒紧凑，并在液相蒸发时将毛孔处的溶解离子重新沉淀。因此，CSP的烧结机制似乎类似于液相烧结（LPS）12，13或压力溶液蠕变（PSC.14-16 CSP研究）很快被采用，数百种关于氧化物CSP、11，17-21无用无物盐、22-25和复合材料26-30的出版物和专利覆盖了应用 包括高频天线、30，31个能量估计电容器、32，33个电池元件、22、24，25变频器、11，26和压电传感器/执行器。 例如 Al2SiO5/NaCl，35 PZT/Pb（NO3）2，18 和 PZT/Li2MoO4.34 在这种情况下， 据推测，可溶性相润滑不溶性陶瓷，从而改善压实。从这个角度看，复合材料中的烧结机制预期与单相情况下的烧结机制有很大不同。这一假设尚未得到证实，其基本机制也没有得到解释。

Of the various energy-efficient sintering techniques, the cold sintering process (CSP) holds the most potential for ultra-low temperature sintering. Though most of the CSP papers have been published within the past 5 years, the origin of this technique may be traced back to the 1800s for metals1,2 and 1950-1960s when researchers started to realize the presence of moisture increased the green density in oxides and sulfates which reduced the sintering temperatures.1,3,4 In the 1970-1980s, the word “cold sintering” was first used to refer to a process utilizing “plastic deformation of powder particles in a high pressure gradient at ambient temperature resulting in green densities close to theoretical” for metals, glass, and ionic crystals.5 At the same time, the hydrothermal hot-pressing (HHP) method was proposed for the densification of cement materials at low temperatures.6,7 Kähäri et al. showed Li2MoO4 (LMO) could be sintered at near room temperatures by adding water and higher uniaxial pressures, noting that large particles are beneficial for the densification.8,9 The group at Penn State University outlined the path towards a universal strategy for the cold sintering process in which particles were mixed with a small amounts of solvent (often aqueous or polar organics). This enabled controlled dissolution at low temperatures and applied pressures; subsequently, the solvent is evaporated from the open system.10 In many cold sintering studies, ceramic pellets can be sintered to ~95% relative density at ~300 °C.8,9,11 In short, densification under such low temperatures is realized by introducing uniaxial pressures in conjunction with transient phases that (often) partially dissolve the ceramics, re-arrange the particle compact, and re-precipitate the dissolved ions at the pores when the liquid phase is vaporized. Thus, the sintering mechanism of CSP seems to be similar to that of liquid phase sintering (LPS) 12,13 or pressure solution creep (PSC).14–16 Research on CSP was quickly adopted with hundreds of publications and patents on the CSP of oxides,11,17–21 inorganic salts,22–25 and composites26–30 covering applications including high frequency antennas,30,31 energy estorage capacitors,32,33 battery components,22,24,25 varistors,11,26 and piezoelectric sensors/actuators.18,34 Cold sintering of inorganic -inorganic composites was achieved by mixing low solubility ceramics with high solubility salts or oxides, such as Al2SiO5/NaCl,35 PZT/Pb(NO3)2,18 and PZT/Li2MoO4.34 In such cases, it is conjectured that the soluble phases lubricate the insoluble ceramics, resulting in improved compaction. From this perspective, the sintering mechanism in the composite is expected to be very different from that in the single-phase case. This hypothesis has not been proved, neither has the underlying mechanism being explained.<br>