1.基准点大小和形状:直径为1.0mm的实心圆。阻焊开窗直径为2.0mm的圆形区域;2.经过SMT设备加工的PCB必须放置基准点;3.基准点的英语翻译

1.基准点大小和形状:直径为1.0mm的实心圆。阻焊开窗直径为2.0m

1.基准点大小和形状:直径为1.0mm的实心圆。阻焊开窗直径为2.0mm的圆形区域;2.经过SMT设备加工的PCB必须放置基准点;3.基准点中心距离板边必须大于3.0mm;4.引脚间距小于≤0.4mm的翼形引脚封装器件和引脚间距≤0.8mm的面阵列封装器件等需要放置局部基准点;5.禁布区:以基准点为圆心,直径A=6mm的圆形区域,该区域内不能有与MARK点形状、大小、颜色接近的设计(如:焊盘、过孔、亮铜、测试孔、测试盘、表层铺碎铜);
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源语言: -
目标语言: -
结果 (英语) 1: [复制]
复制成功!
1. The size and shape of the reference point: a solid circle with a diameter of 1.0mm. The solder mask window is a circular area with a diameter of 2.0mm; <br>2. The reference point must be placed on the PCB processed by the SMT equipment; <br>3. The distance between the center of the reference point and the edge of the board must be greater than 3.0mm; <br>4. The pin spacing is less than 0.4mm Shaped-pin packaged devices and area array packaged devices with a pin pitch ≤ 0.8mm need to place local reference points; <br>5. Forbidden area: a circular area with a reference point as the center and a diameter of A=6mm. <br>Design similar to the shape, size and color of the MARK point (such as: pad, via, bright copper, test hole, test disk, surface layer copper);
正在翻译中..
结果 (英语) 2:[复制]
复制成功!
1. Base point size and shape: a solid circle with a diameter of 1.0mm. a circular area with a diameter of 2.0mm in the welded open window;<br>2. The PCB processed by SMT equipment must place the reference point;<br>3. The center distance of the base point must be greater than 3.0mm from the edge of the board;<br>4. The wing pin package device with pin spacing of less than ≤0.4mm and the face array package device with pin spacing of ≤0.8mm need to place local reference points;<br>5. No cloth area: with the base point as the center of the circle, the diameter of the A-6mm circular area, the area can not have the shape of the MARK point,<br>Size, color close to the design (e.g. pad, perforation, bright copper, test hole, test disk, surface shredded copper);
正在翻译中..
结果 (英语) 3:[复制]
复制成功!
1. Size and shape of datum point: solid circle with diameter of 1.0 mm. A circular area with a resistance welding window diameter of 2.0 mm;<br>2. The PCB processed by SMT equipment must be placed with reference point;<br>3. The distance between the center of the datum point and the edge of the plate must be greater than 3.0 mm;<br>4. The local reference points should be placed for the wing pin package with the pin spacing less than or equal to 0.4mm and the plane array package with the pin spacing less than or equal to 0.8mm;<br>5. No distribution area: a circular area with a diameter of 6 mm centered on the datum point, in which there shall be no mark point shape<br>Design with similar size and color (e.g. pad, via, bright copper, test hole, test panel, surface copper paving);<br>
正在翻译中..
 
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