1. Base point size and shape: a solid circle with a diameter of 1.0mm. a circular area with a diameter of 2.0mm in the welded open window;<br>2. The PCB processed by SMT equipment must place the reference point;<br>3. The center distance of the base point must be greater than 3.0mm from the edge of the board;<br>4. The wing pin package device with pin spacing of less than ≤0.4mm and the face array package device with pin spacing of ≤0.8mm need to place local reference points;<br>5. No cloth area: with the base point as the center of the circle, the diameter of the A-6mm circular area, the area can not have the shape of the MARK point,<br>Size, color close to the design (e.g. pad, perforation, bright copper, test hole, test disk, surface shredded copper);
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