Silicon sputtering targets can be divided into two types: single crystal and polycrystalline. We produce planar silicon sputtering targets by the Czochralski crystal growth method. Mainly used in semiconductor chips, flat-panel liquid crystal displays (LCD), decoration and functional coating industry, solar panels, data storage industry (optical disk industry), optical communication industry, glass coating (construction glass and automotive glass) industry, corrosion resistance and abrasion resistance (Surface modification) and other fields.
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