然而反应刚开始时硫酸铜中铜离子的沉积速率却比硝酸铜的略低，是因为不同阴

However, at the beginning of the reaction, the deposition rate of copper ions in copper sulfate is slightly lower than that of copper nitrate. This is because different anions have different chemical properties and their ability to form ion pairs with the same cation is different. It can be expressed by the ion pair generation constant pK. The ion pair formation constants of sulfate, chloride and nitrate ions and copper ions are pk1-2.36, respectively. It can be seen that the ability of SO24-and Cu2 + to generate ion pairs is much greater than that of Cl-and NO-3

However, the deposition rate of copper ions in copper sulfate at the beginning of the reaction is slightly lower than that of copper nitrate because different anions, due to their different chemical properties, do not have the same ability to generate ion pairs with the same cation, the size of which can be expressed by the ion pair to generate a constant pK. The ion pair generation constants of sulfate, chlorine and nitric acid ions and copper ions are pk1-2.36, respectively, which shows that SO24 - and Cu2 - have much greater ability to produce ion pairs than Cl - and NO-3.

However, at the beginning of the reaction, the deposition rate of copper ions in copper sulfate is slightly lower than that of copper nitrate, because different anions have different chemical properties, their ability to form ion pairs is different from that of the same cation. The magnitude of this ability can be expressed by the constant PK of ion pair formation. The ion pair formation constants of sulfate, chloride, nitrate and copper ions are pk1-2.36, respectively. It can be seen that the ability of SO24 - and Cu2 + to form ion pairs is much greater than that of Cl - and NO-3<BR>