We will assign pattern limits based

We will assign pattern limits based on actual measurements of the test samples. The conductor width measurement tolerance is as follows: -Conductor width of 0.12 mm (5 mil) or greater, measured width may not be greater than ±0.025 mm (1 mil) of the requested width. -Conductor less than 0.12 mm (5 mil), measured width may not be greater than ±20% of the requested width. The attachment containing Figures 10.1, 10.2, and 10.3 (taken from the UL Standard for Safety for Printed-Wiring Boards, UL 796), illustrate typical test patterns. The test pattern should appear on both sides of the sample, one side being the mirror image of the other. If you desire Recognition for single sided printed wiring boards only, the test pattern need only appear on one side of the sample. You may want to submit various maximum area diameter sizes as Recognition will be granted based upon the largest compliant circle. If the maximum unpierced diameter won't fit on the test pattern, please provide a separate set of samples. You may etch these into either a circle or a square. DELAMINATION ONLY SAMPLES - The conductor pattern that you use for Delamination samples may be either an etched circle or a square. It should be of the largest diameter unpierced area for which you wish or have Recognition. The attachment containing Figures 10.1, 10.2, and 10.3 (taken from the UL Standard for Safety for Printed-Wiring Boards, UL 796), illustrate how to determine the maximum unpierced conductor area and a typical delamination test pattern. The maximum unpierced conductor area may exceed the diameter requested, but may not be less than the requested; otherwise the Recognition may be limited to the maximum area diameter submitted. MULTILAYER CONSTRUCTION - For multilayer boards, the same conductor pattern must be used on the external and internal layers. Position the unpierced areas directly over each other. The multilayer sample construction shall include two or more internal conductor layers. One of the internal conductor layers must be the maximum internal conductor thickness. The sample must also include the minimum laminate (core) and B-Stage (prepreg) sheet thicknesses to be Recognized for the Printed Wiring Board Type. For additional instructions on multilayer sample construction, refer to UL Standard for Safety for Printed-Wiring Boards, UL 796, Section 17. Note - The board total build-up thickness should be at the thickness or within the range specified in the attached sample requirements.

We will assign pattern limits based on actual measurements of the test samples. The conductor width measurement tolerance is as follows:  -Conductor width of 0.12 mm (5 mil) or greater, measured width may not be greater than ±0.025 mm (1 mil)  of the requested width.  -Conductor less than 0.12 mm (5 mil), measured width may not be greater than ±20% of the requested width. The attachment containing Figures 10.1, 10.2, and 10.3 (taken from the UL Standard for Safety for Printed-Wiring   Boards, UL 796), illustrate typical test patterns. The test pattern should appear on both sides of the sample, one side being the mirror image of the other.  If you desire Recognition for single sided printed wiring boards only, the test pattern need only appear on one  side of the sample. You may want to submit various maximum area diameter sizes as Recognition will be granted based upon the   largest compliant circle. If the maximum unpierced diameter won't fit on the test pattern, please provide a separate set of samples.  You may etch these into either a circle or a square.  DELAMINATION ONLY SAMPLES - The conductor pattern that you use for Delamination samples may be either   an etched circle or a square. It should be of the largest diameter unpierced area for which you wish or have  Recognition. The attachment containing Figures 10.1, 10.2, and 10.3 (taken from the UL Standard for Safety for Printed-Wiring   Boards, UL 796), illustrate how to determine the maximum unpierced conductor area and a typical delamination   test pattern. The maximum unpierced conductor area may exceed the diameter requested, but may not be less than the   requested; otherwise the Recognition may be limited to the maximum area diameter submitted.  MULTILAYER CONSTRUCTION - For multilayer boards, the same conductor pattern must be used on the   external and internal layers. Position the unpierced areas directly over each other. The multilayer sample construction shall include two or more internal conductor layers. One of the internal   conductor layers must be the maximum internal conductor thickness. The sample must also include the   minimum laminate (core) and B-Stage (prepreg) sheet thicknesses to be Recognized for the Printed Wiring   Board Type.  For additional instructions on multilayer sample construction, refer to UL Standard for Safety for Printed-Wiring   Boards, UL 796, Section 17.  Note - The board total build-up thickness should be at the thickness or within the range specified in the attached   sample requirements.

0/5000

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结果 (简体中文) 1: [复制]

复制成功！

我们将根据测试样品的实际测量值分配图案极限。 导体宽度测量公差如下：- 导体宽度为0.12毫米（5密耳）或更大，测量宽度不得大于 要求宽度的±0.025毫米（1密耳）。 -导体小于0.12毫米（5密耳），测量宽度不得大于要求宽度的±20％。 包含图10.1、10.2和10.3的附件（摘自UL印刷线路板安全标准 ，UL 796），说明了典型的测试模式。 测试图案应出现在样品的两侧，一侧是另一侧的镜像。 如果只希望对单面印刷线路板进行识别，则测试图案仅需要出现在 样品的一侧。 您可能要提交各种最大的直径区域尺寸，因为将根据 最大的顺应圆来授予识别权。 如果最大未刺穿直径不适合测试图案，请提供另一套样品。 您可以将它们蚀刻成圆形或正方形。 仅分层样本-用于分层样本的导体图案可以是 蚀刻的圆形或正方形。它应该是您希望或具有 识别功能的最大直径未打孔区域。 包含图10.1、10.2和10.3的附件（摘自UL印刷线路板安全标准 ，UL 796），说明了如何确定最大未刺穿导体面积和典型的分层 测试图案。 未穿刺的最大导体面积可超过要求的直径，但不得小于要求的直径 ；否则，认可可能仅限于提交的最大面积直径。 多层结构-对于多层板， 外层和内层必须使用相同的导体图案。将未刺穿的区域直接放在彼此上方。 多层样品结构应包括两个或多个内部导体层。内部之一 导体层必须是最大内部导体厚度。样品还必须包括 印刷线路板 类型要识别的最小层压板（芯）和B级（预浸料）板厚度。 有关多层样品结构的其他说明，请参阅UL印刷线路板安全标准 ，UL 796，第17节。 注-板的总堆积厚度应在所附 样品要求中指定的厚度或范围内。

正在翻译中..

结果 (简体中文) 2:[复制]

复制成功！

We will assign pattern limits based on actual measurements of the test samples. The conductor width measurement tolerance is as follows: -Conductor width of 0.12 mm (5 mil) or greater, measured width may not be greater than ±0.025 mm (1 mil) of the requested width. -Conductor less than 0.12 mm (5 mil), measured width may not be greater than ±20% of the requested width. The attachment containing Figures 10.1, 10.2, and 10.3 (taken from the UL Standard for Safety for Printed-Wiring Boards, UL 796), illustrate typical test patterns. The test pattern should appear on both sides of the sample, one side being the mirror image of the other. If you desire Recognition for single sided printed wiring boards only, the test pattern need only appear on one side of the sample. You may want to submit various maximum area diameter sizes as Recognition will be granted based upon the largest compliant circle. If the maximum unpierced diameter won't fit on the test pattern, please provide a separate set of samples. You may etch these into either a circle or a square. DELAMINATION ONLY SAMPLES - The conductor pattern that you use for Delamination samples may be either an etched circle or a square. It should be of the largest diameter unpierced area for which you wish or have Recognition. The attachment containing Figures 10.1, 10.2, and 10.3 (taken from the UL Standard for Safety for Printed-Wiring Boards, UL 796), illustrate how to determine the maximum unpierced conductor area and a typical delamination test pattern. The maximum unpierced conductor area may exceed the diameter requested, but may not be less than the requested; otherwise the Recognition may be limited to the maximum area diameter submitted. MULTILAYER CONSTRUCTION - For multilayer boards, the same conductor pattern must be used on the external and internal layers. Position the unpierced areas directly over each other. The multilayer sample construction shall include two or more internal conductor layers. One of the internal conductor layers must be the maximum internal conductor thickness. The sample must also include the minimum laminate (core) and B-Stage (prepreg) sheet thicknesses to be Recognized for the Printed Wiring Board Type. For additional instructions on multilayer sample construction, refer to UL Standard for Safety for Printed-Wiring Boards, UL 796, Section 17. Note - The board total build-up thickness should be at the thickness or within the range specified in the attached sample requirements.

正在翻译中..

结果 (简体中文) 3:[复制]

复制成功！

我们将根据测试样本的实际测量值来指定模式限制。 导线宽度测量公差如下： -导体宽度为0.12 mm（5 mil）或更大，测量宽度不得大于±0.025 mm（1 mil） 所需宽度的。 -导线小于0.12 mm（5 mil），测量宽度不得大于要求宽度的±20%。 包含图10.1、10.2和10.3的附件（摘自UL印刷线路安全标准 电路板，UL 796），说明了典型的测试模式。 测试模式应该出现在样品的两边，一边是另一边的镜像。 如果您只想识别单面印刷线路板，则测试图案只需出现在 样品的侧面。 您可能希望提交各种最大面积直径大小，因为识别将基于 最大的顺应圈。 如果最大未穿孔直径不符合试验模式，请提供一套单独的样品。 你可以把这些刻成圆形或正方形。 仅分层样本-用于分层样本的导体模式可以是 蚀刻的圆或正方形。它应该是您希望或拥有的最大直径的未穿孔区域 认可。 包含图10.1、10.2和10.3的附件（摘自UL印刷线路安全标准 电路板，UL 796），说明如何确定最大未穿孔导体面积和典型分层 测试模式。 最大未穿线导体面积可超过要求的直径，但不得小于 要求；否则，认可可能仅限于提交的最大面积直径。 多层结构-对于多层板，必须在 外部和内部层。将未穿孔区域彼此直接放置。 多层样品结构应包括两个或更多内部导体层。一个内部的 导体层必须为最大内部导体厚度。样品还必须包括 印刷线路的最小层压板（芯）和B级（预浸料）板厚度 板类型。 有关多层样品结构的附加说明，请参考UL印制线路安全标准 电路板，UL 796，第17节。 注-板的总堆积厚度应在所附的 样品要求。

正在翻译中..

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