Wafer Alignment- First Die IntegrityUses predefined wafer level unique structure for global wafer positioningAdd the patterns only after Die MappingIn case of small dice, used to overcome row or column inaccuracy (first die)Framed wafers with shifted diceIn case where there is no unique structure in wafer level(test die, corner, etc.use the notch I flat for first die integrityIn stretched wafer it is different-you need to add WLUP close one to the other.Scan DiamDie Index x(mm)AddDelete Unique patternPrior to wafer alignment the ME AOISelect 2-3 unique patternssystems check and fix handling inaccuracyfor first die integrityTD4M11700