1.6. Limitations and Exceptions:1.6.1. Selection of Cleaning Practices: Adequate cleaning requires a proper combination of practices, such as degreasing, acid etching, acid cleaning and rinsing, etc. The choice and optimization of these practices shall be based on the knowledge of the materials to be cleaned and of the type of contaminants to be removed. Each recipe included in this specification is dedicated for each type of materials and shall not be applied for components made of various different materials.1.6.2. Sub-Surface Inactivity: Cleaning processes are only effective in reducing the levels of surface contaminants, such as particles, ionic contaminants, and hydrocarbons that are introduced during the fabrication of components. Cleaning will not remove any impurities incorporated in the materials. Any contaminants embedded in materials during fabrication processes cannot be readily removed by 0250-20000.1.6.3. Imperfections: The cleaning process may manifest cosmetic imperfections, such as grain structures in the materials and machining patterns, etc.1.6.4. Caution for Sensitive Materials: The cleaning processes in this specification shall be used with caution on components that have been plated, coated, electro-polished, passivated, or joined to other materials. The chemicals used in various recipes may damage, corrode, or degrade such parts.