探究了硅片在硝酸溶液的浸没时间对制绒形貌的影响，再经过后处理，最后制得

We investigated the effects on the morphology of the wafer texturing nitric acid solution in the immersion time, and then after processing, the final prepared millimeter pit morphology, the minimum reflectance is less than 20%

The effect of the leaching of silicon wafers in nitric acid solution on the velvet-shaped appearance was explored, and then after reprocessing, the final millimeter-level pit-shaped appearance was made with a minimum reflectivity of less than 20%

The effect of immersion time of silicon wafer in nitric acid solution on the morphology of cashmere was studied. After post-treatment, the millimeter level pit morphology was obtained, with the lowest reflectivity less than 20%