The gas preferentially condenses and etches on the scratches or protrusions of the silicon wafer, so the cut lines on the surface of the silicon wafer are easily corroded and flattened.
The gas first condenses and etched at the scratch or protrusion of the silicon chip, so that the cutting pattern on the surface of the silicon sheet is easily eroded and flattened.
The gas preferentially condenses and etches on the scratch or protuberance of the silicon wafer, so the cutting lines on the surface of the silicon wafer are easy to be corroded and flattened,<BR>