Depth of laser markingDefinition: Marking depth of laser calculated from top module surface to bottom of the lasercut. Too shallow marking will lead to not enough contra between mark area and unmark areawhile too deep marking will lead to shadow effect and not enough contra for dark surfacebackgroundSpec Limit: 30-60 μm for process with laser marking before shielding.5 -10 μm for process with laser marking after shielding