The information in the report seems to be not coherent.Can you please Clarify the following items?Were you able to locate the failure of board (Short) when you reviewed your test records?2) What do you mean by “Outflow reason: during test process, workers didn't detect resistance value less than the setted insulation value such problem.” Does this mean the operator did not catch the board failed by the tester?3) As per our engineering ,the x-ray image shows what seems like a liquid that got dragged over to the other conductor causing the short. This could be the etch resist used before etching to create the circuitry.4) What is the test parameter used to test the complete batch of this board part number?5) Can you please send us the copy of flying probe test report for this board?