In the actual GaAs polishing process, agglomeration occurs between the abrasive particles and other particles, that is, the diameter of the abrasive particles is increased.
In the actual GaAs polishing process, the reunion between the grinding grain and other particles occurs, i.e. the diameter size of the grinding grain is increased.
During the polishing process of GaAs, there will be agglomeration between the abrasive particles and other particles, that is to say, the diameter and size of the abrasive particles will be increased.