砂浆切割和金刚线切割是如今光伏领域主要的硅锭切片技术，其中砂浆切割首先

Mortar cutting and diamond wire cutting is now the main areas of photovoltaic silicon ingot slicing technology, which was first used in the mortar cutting industrial and prevailed for a long period of time, but with the advancement of technology and people's pursuit of efficiency and cost reduction mentioning the continuous improvement of environmental awareness, mortar cutting technology gradually exposed slice of low efficiency, high consumption without environmental shortcomings, increasingly unable to keep pace with modern industry forward. In 2010, the diamond wire cutting technology for its high efficiency, low loss and environmental advantages fling, and has been fully applied to the cutting of monocrystalline silicon, but the diamond wire cutting multicrystalline silicon wafers fewer defects and stubborn cutting lines as well as non crystal layer is present, so that the process can not be applied to conventional texturing polycrystalline diamond cutting sheet, thereby impeding the diamond wire cutting technique polysilicon field full coverage

Mortar cutting and king diamond wire cutting is now the main silicon ingot slicing technology in the field of photovoltaics, in which mortar cutting was first applied to industrialization and prevailed for a long period of time, but with the progress of science and technology and people's pursuit of reduced efficiency and the continuous improvement of environmental awareness, mortar cutting technology gradually exposed the low efficiency of slices, The disadvantages of high losses and environmental protection are increasingly unable to keep up with the advance of modern industry. In 2010, The King Kong wire cutting technology with its high efficiency, low loss and environmental protection advantages, and has been fully applied to the cutting of single crystal silicon, but due to the king gold wire cutting polysilicon wafers less defects and stubborn cutting patterns and the presence of amorphous layers, so that the traditional velvet process can not be applied to the King Kong wire cutting polysilicon wafers, This in turn hinders the full coverage of the king's wire cutting technology in the field of polysilicon

Mortar cutting and diamond wire cutting are the main silicon ingot slicing technologies in the field of photovoltaic. Mortar cutting is first applied in industrialization and has been popular for a long time. However, with the progress of science and technology, the pursuit of cost reduction and efficiency improvement and the continuous improvement of environmental awareness, mortar cutting technology gradually exposes the shortcomings of low efficiency, high loss and environmental protection Can't keep up with the pace of modern industry. In 2010, Vajra wire cutting technology showed its advantages of high efficiency, low loss and environmental protection, and has been widely used in the cutting of monocrystalline silicon. However, due to the less defects of Vajra wire cutting polycrystalline silicon wafers and the existence of stubborn cutting lines and amorphous layers, the traditional cashmere making technology can not be used in Vajra wire cutting polycrystalline silicon wafers, thus hindering Vajra wire cutting technology in polycrystalline silicon Comprehensive coverage of the field<BR>