在氯化铜溶液中，一部分铜离子得到电子还原形成铜单质，一部分铜离子与氯离

In the copper chloride solution, part of the copper ions are reduced by electrons to form copper element, and part of the copper ions form CuCl2 complexes with chloride ions, as shown in Reactions 2 and 3. In addition, the deposited copper may also be in the chloride-rich solution CuCl2 complex is formed during the conversion in the medium. Thirdly, because there are more CuCl2 complexes, the migration of ions in the solution is greatly hindered. In this way, the deposition of copper on the silicon wafer is naturally slow and less

In the copper chloride solution, some copper ions are electron reduced to form copper monotony, some copper ions and chlorine ions form CuCl2 litho, as shown in reaction 2,3, in addition, the deposited copper may also be in the chloride-rich solution into the formation of CuCl2 enseging, third, due to more CuCl2 hydrants, hindering the migration of ions in the solution is greatly hindered, so that the deposition of copper on the silicon wafer is naturally less.

In the copper chloride solution, some copper ions are reduced by electron to form copper element, and some copper ions form CuCl2 complex with chloride ion, as shown in reactions 2 and 3. In addition, the deposited copper may transform into CuCl2 complex in the solution rich in chloride ions. Thirdly, due to the large number of CuCl2 complexes, the migration of ions in the solution is greatly hindered, The deposition of copper on silicon is naturally slower and less<BR>