导弹侵彻靶标的过程中，引信电子组件必然会经受较大的冲击、振动过载，由于

When the missile penetrates the target, the electronic components of the fuze will inevitably endure greater impact and vibration overload. Due to the low structural strength of the electronic assembly itself, it will inevitably cause damage to the electronic components in the case of large overload. In order to improve the resistance to large overloads of electronic components, electronic assemblies are generally encapsulated. During the flow of the encapsulating compound, due to its high viscosity and short operation time, voids are easily generated. Through process research, an integrated packaging method of vacuuming, vibration and heating was proposed, and reasonable process routes and process parameters were found. Through experiments, this solution can effectively eliminate voids and reduce the size of the voids in the electronic component package, meeting the company's anti-hard target electronic component resistance to large overload environment requirements.

In the process of missile intrusion into the target, the fuze electronic component is bound to experience greater shock and vibration overload, because the structure strength of the electronic assembly itself is low, which will inevitably lead to the damage of the electronic component under the condition of large overload. In order to improve the ability of electronic components to resist large overload, the electronic assembly will generally be packaged, packaging glue in the flow process due to its greater viscosity, shorter operating time, easy to produce holes. Through the process research, a vacuum, vibration, heating integrated package method is proposed, and a reasonable route, process parameters. Through the experiment, the scheme can effectively eliminate the hole and reduce the hole size of the electronic component package, and meet the requirements of the company's anti-hard target electronic component sized against large overload.

In the process of missile penetrating the target, the electronic components of fuze will inevitably suffer from great impact and vibration overload. Due to the low structural strength of electronic assembly, the electronic components will inevitably be damaged under the condition of large overload. In order to improve the anti overload ability of electronic components, electronic assembly parts are usually packaged. Because of its high viscosity and short operation time, the packaging compound is easy to produce cavities in the flow process. Through the process research, a vacuum, vibration, heating integrated packaging method is proposed, and the reasonable process route and process parameters are explored. Through the test, the scheme can effectively eliminate the hole and reduce the size of the cavity in the electronic component package, and meet the company's anti hard target electronic component anti overload environment requirements.<br>