The schematic diagram for the detailed structure of MLCCs and the fabrication procedure of MLCCs is illustrated in Fig. 2. MLCCs consist of many dielectric layers and inner electrodes which are alternately stacked in parallel. The inner electrodes are connected to outer termination for surface mounting. Recently, base metal, such as Ni and Fe, is mainly used as inner electrode materials by replacing expensive Pd and outer termination is composed of Cu, Ag, Ni plating layer, and Sn plating layer. The capacitance of the MLCCs can be expressed as,